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[DIP-25] Insulation class: 1.5V / 1 min, bootstrap functionality
Negotiable
Voltage: 600V\nCurrent: 10A\n\nIntegrated 6 fast recovery power MOSFETs\nIntegrated high voltage gate drive circuit\nCompatible with 3.3 V & 5 V input signal, effective at high level\nIntegrated temperature output\nBuilt-inquick recovery boot strap diode\nInsulation class 1500 Vrms / min\nIntegrated bootstrap functionality\nHigh reliability and thermal stability, good parameter consistency
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Product Details: SYIM10G60BTE
The DIP-25 refers to a dual in-line package with 25 pins. Its value lies not in miniaturization, but in its outstanding robustness, reliability, and ease of use.
The through-hole solder joints provide a mechanically secure structure capable of enduring strong vibration, mechanical shock, and repeated temperature cycles—conditions that often cause fatigue cracks in surface-mount joints.
This makes the DIP-25 package indispensable in industrial, automotive, and aerospace systems operating under harsh environmental conditions.
Features:
- Integrated 6 fast recovery power MOSFETs
- Integrated high voltage gate drive circuit
- Compatible with 3.3 V & 5 V input signal, effective at high level
- Integrated temperature output
- Built-inquick recovery boot strap diode
- Insulation class 1500 Vrms / min
- Integrated bootstrap functionality
- High reliability and thermal stability, good parameter consistency
Internal Electrical Schematic:
